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[SITUATION] · [ACTIVE] · [BUSINESS]
2 clusters · 3 sources · 25 days · First seen · Last updated
Non-Conductive Film semiconductor packaging market
Overview
The market for Non-Conductive Film (NCF), an insulating adhesive used in semiconductor packaging, is projected to reach approximately 21.58 million USD by 2026. Driven by a compound annual growth rate of over 20%, the market is expected to reach roughly 65.54 million USD by 2032.
Growth is fueled by the increasing complexity of High Bandwidth Memory (HBM) and advanced packaging technologies like 3D stacking and 2.5D packaging. These technologies are essential for AI servers, high-performance computing (HPC) systems, and high-performance GPUs.
Samsung Electronics has influenced this shift with plans for the mass production and shipment of HBM4 in early 2026. As HBM evolves, NCF must meet more rigorous standards for bonding precision, insulation, and thermal stress control. Industry challenges include maintaining high fluidity during thermal compression bonding while achieving thinner films and reducing voids.
Entities
QY Research · Nippon Graphite · Element Solutions · Henkel · Samsung Electronics
Timeline
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2 days ago
[TECHNOLOGY] 2 sourcesNon-Conductive Film market projected to reach 21.58 million USD by 2026The global Non-Conductive Film (NCF) market is projected to reach over 65 million USD by 2032, driven by rising demand for advanced semiconductor packaging and High Bandwidth Memory (HBM) for AI applications.
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27 days ago
[BUSINESS] 2 sourcesConductive carbon paste market projected to reach 114 million USD by 2026The global conductive carbon paste market is expected to reach 114 million USD by 2026, driven by demand in printed electronics, sensors, and wearable devices.
Sources
dreamnews.jp · the-miyanichi.co.jp · youthsoccercup.com