[REVISION HISTORY]
SEMICON Taiwan 2026: Expanding focus on AI and ecosystem
Updated 5 times since CLSTR started tracking revisions of this situation.
What changed
2026-08-25 21:56 UTC → 2026-08-26 00:52 UTC ·
added
removed
SEMICON Taiwan 2026 is scheduled for September 2–4 in Taipei under the theme ‘Transform Tomorrow’. The summit is expanding its Master Conference and Global Ecosystem Summit from a half-day to a full-day format to address rapid industry evolution, specifically regarding AI, advanced packaging, and process equipment. To support AI chip demand and supply chain resilience, the event will feature a ‘Smart Fab Zone’, a ‘Silicon Startups Zone’, and a Smart Manufacturing Pavilion. Major participants include TSMC, MediaTek, ASUS, Acer, and Foxconn. AAEON will demonstrate edge AI and high-performance computing solutions, including a live AI vision wafer inspection system using the BOXER-8651AI-PLUS and NVIDIA Jetson Orin NX, alongside upcoming products like the MAXER-5000 featuring NVIDIA Jetson Thor modules. Exhibitors such as Kanematsu Corporation and NS Technologies will showcase front-end and back-end solutions, including MOCVD and plasma sputtering systems, alongside products from Nippon Sanso and JSW AFT. Lam Research is also set to present advancements in plasma etching for 3D components, Co-Packaged Optics (CPO), and panel-level fan-out packaging (FOPLP). South Korean participation is expanding, with Okins Electronics and LG Chem set to showcase AI-related solutions. Okins Electronics will present semiconductor testing components, such as self-developed burn-in sockets and ultra-precision connectors, targeting high-temperature and high-voltage environments for AI and high-performance computing (HPC) packaging. LG Chem will utilize an ‘Advanced Package Zone’ to present materials for High Bandwidth Memory (HBM), including glass core solutions and die attachment films (DAF), while its ‘Power Package Zone’ will focus on thermal management for AI data center power semiconductors. The event highlights broader ecosystem integration. Taiwan High Speed Rail is positioning itself as a critical link for talent and resource movement across the Hsinchu-Kaohsiung industrial corridor, while energy provider Star Power is expanding services to support high-consumption semiconductor manufacturing and AI data centers.
Versions
- 2026-08-26 00:52 UTC SEMICON Taiwan 2026: Expanding focus on AI and ecosystem
- 2026-08-25 21:56 UTC SEMICON Taiwan 2026: Expanding focus on AI and ecosystem
- 2026-08-20 06:24 UTC SEMICON Taiwan 2026 industry summit
- 2026-08-19 10:41 UTC SEMICON Taiwan 2026 industry summit
- 2026-08-19 05:26 UTC SEMICON Taiwan 2026 industry summit
- 2026-08-17 02:57 UTC SEMICON Taiwan 2026 industry summit
Only revisions since CLSTR began indexing content versions appear here. Select a version to see what changed compared to the one before it.