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2 clusters · 6 sources · 7 days · First seen · Last updated

Semiconductor material and equipment production expansion

Overview

Major manufacturers are increasing production capacity to meet rising demand for advanced chipmaking and semiconductor processes.

Tokyo Ohka Kogyo has completed a 23 billion yen facility in Fukushima Prefecture for photoresist production, including EUV and ArF materials, with operations expected to begin in November 2026. In the United States, Fujifilm is investing approximately 30 million yen to expand its semiconductor material base in Mesa, Arizona, focusing on copper wiring CMP slurries to support advanced packaging.

Canon is reportedly planning to increase its production capacity for semiconductor lithography equipment used in back-end processes by 50% by 2029, driven by demand from high-bandwidth memory (HBM) manufacturers. This expansion will utilize a new plant in Utsunomiya scheduled to reach full capacity by 2027.

Entities

Tokyo Ohka Kogyo Co., Ltd. · Fujifilm Corporation · Canon · Instax · Fujifilm

Timeline

  1. [BUSINESS] 2 sources
    Fujifilm and Canon announce production expansions to meet rising demand

    Fujifilm is investing 3 billion JPY to boost instax™ film production by 20%, while Canon plans a 50% capacity increase for semiconductor lithography equipment by 2029.

  2. [BUSINESS] 4 sources
    Tokyo Ohka and Fujifilm expand semiconductor material production

    Tokyo Ohka Kogyo and Fujifilm are investing heavily in semiconductor materials, with new facilities in Japan and the US to boost supply of photoresists and CMP slurries.

Sources

eetimes.jp · finance.technews.tw · global-net.co.jp · inbusinessphx.com · news.mynavi.jp · ohsem.me