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SK Hynix semiconductor production and AI supply chain

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2026-09-29 07:02 UTC → 2026-09-29 13:03 UTC · added ~~removed~~

SK Hynix is executing a strategic global expansion of its semiconductor manufacturing footprint to meet surging AI-related demand. The company has officially broken ground on its $4 billion advanced packaging and R&D facility at Purdue Research Park in West Lafayette, Indiana. This facility will serve as a U.S. hub for high-bandwidth memory (HBM), where DRAM wafers manufactured in South Korea will be shipped for stacking, packaging, and testing. Mass production at the Indiana site is projected to begin in the second half of 2029. To manage rising costs and design complexity, SK Hynix is pursuing a multi-vendor manufacturing strategy. While the company has evaluated Intel Foundry as a potential supplier for HBM4E base dies, it has clarified that no specific plans have been finalized regarding memory chip production in the United States. Separately, SK Hynix subsidiary Solidigm is evaluating the construction of a large-scale NAND flash memory manufacturing facility in the U.S., with upstate New York identified as a potential site. Reports indicate Solidigm may consider an initial public offering (IPO) as early as 2027, with a potential valuation of up to $100 billion. Strengthening the AI supply chain, Nvidia CEO Jensen Huang recently received the Gen. James Van Fleet Award at The Korea Society’s annual gala in New York. During the event, Huang met with Samsung Electronics Chairman Lee Jae-yong and SK Group Chairman Chey Tae-won to discuss next-generation HBM, such as HBM4E and HBM5. Chey Tae-won characterized the relationship between Nvidia and SK as a synergy where Nvidia designs the ‘brain’ while SK provides the ‘memory.’ Additionally, SK Telecom is reportedly planning to build an AI factory in South Korea with a capacity of up to 2 gigawatts using Nvidia's DSX platform.

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