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TSMC accelerates 1.4nm roadmap and expands global facilities

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2026-10-21 08:32 UTC → 2026-10-21 09:36 UTC · added ~~removed~~

Taiwan Semiconductor Manufacturing Co. (TSMC) is accelerating its technological roadmap and domestic expansion to meet global AI and consumer electronics demand. The company is fast-tracking its 1.4nm (14A node) production timeline, with mass production now slated for the second half of 2027. Apple is reportedly targeting this 1.4nm capacity for its 2028 iPhone lineup to secure transistor density and power efficiency while mitigating supply risks from competitors like NVIDIA. Apple’s transition to the 1.4nm process is expected to debut in 2028 with the A22 Pro chip for premium models. This technological leap aims to enhance on-device AI capabilities and improve power efficiency by up to 30%. This follows reports of a revised Apple launch strategy that prioritizes high-end models and its first foldable, the iPhone Duo, ahead of standard lineup releases. TSMC is significantly expanding its global manufacturing footprint. In the United States, a new facility in Arizona is scheduled to begin commercial mass production of 3nm chips in the second half of 2027. To support these advancements, TSMC’s 2026 capital budget is estimated between $60 billion and $64 billion, with 70% to 80% of funds dedicated to advanced manufacturing nodes. The company is also developing angstrom-level processes, including A16 and A14, and collaborating with ASML on High-NA EUV equipment. In Japan, TSMC is advancing plans to manufacture next-generation 3nm semiconductors at its second factory in Kumamoto to bolster domestic capabilities for AI and high-performance computing. This expansion is expected to benefit the broader Japanese semiconductor ecosystem, including suppliers of specialized equipment and chemicals. Kumamoto. Domestically, TSMC continues to deepen its footprint in Taiwan, including a new 3nm facility in Tainan’s Southern Taiwan Science Park expected to begin mass production in the first half of 2028.

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