Apple to advance M6 Pro and M6 Max chips using advanced packaging

Apple is reportedly continuing the development of its M6 Pro and M6 Max chips, despite previous rumors suggesting the company might skip these models to focus on the M7 series. The upcoming chips are expected to utilize advanced packaging technologies from TSMC to achieve unprecedented interconnect density.

Key technologies include SoIC-MH (System on Integrated Chip-Multi-die Hybrid), which allows for high-density vertical stacking of CPU and GPU dies to reduce signal latency, and WMCM (Wafer-level Multi-Chip Module), which enables horizontal interconnection of stacked modules with high-bandwidth memory. This dual-packaging approach aims to lower power consumption and eliminate signal distortion caused by long-distance wiring.

While some reports suggest Apple may prioritize AI-focused upgrades for the M7 series, the implementation of these modular architectures is expected to improve chip yields and performance. TSMC is reportedly expanding capacity to support these requirements, with WMCM monthly wafer capacity projected to reach 60,000 by late 2026 and 120,000 by 2027.