BYD advances vertical integration with new radar chip and Indonesian manufacturing goals

BYD is advancing its vertical integration through both semiconductor production and expanded manufacturing capabilities. Its unit, BYD Semiconductor, has commenced mass production of a next-generation 4D millimeter-wave radar chip. Built on a 28-nanometer process, the chip utilizes the in-house Xuanji A3 smart-driving chip as its computing hub. It is designed to support Level 2 through Level 4 autonomous driving applications, offering a detection range exceeding 400 meters and high-resolution data to improve performance in complex urban environments.

In Indonesia, BYD is working toward increasing its local component level (TKDN) to 60 percent for all product lines by January 2027. Following the inauguration of a Rp16 trillion factory in Subang, West Java, the company is transitioning from an import-reliant model to localized production. The company plans to implement full manufacturing processes, including stamping, welding, and painting, to meet these domestic content targets and support its growing electric vehicle lineup in the region.