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[TECHNOLOGY] · 2 sources

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Part of situation: Cadence semiconductor technology partnerships (2 clusters)

Cadence announces new partnerships with Analog Devices and TSMC

semiconductor design DSP architecture AI chip design automotive audio 3D-IC

Cadence has announced several strategic collaborations within the semiconductor industry to advance AI and automotive technologies.

In partnership with Analog Devices, Inc. (ADI), Cadence is utilizing its Tensilica DSP architecture to develop the next generation of SHARC automotive audio processors. This new architecture aims to provide a fivefold performance increase over previous generations, supporting advanced automotive features such as automated driving alerts, acoustic vehicle alerting systems, and immersive 3D audio rendering.

Separately, Cadence has expanded its partnership with TSMC to support AI and high-performance computing (HPC) designers. The collaboration includes tool certification for TSMC’s A14 process and the introduction of new silicon-proven IP for N3P and N2P technologies. These advancements are designed to enable agentic AI chip and 3D-IC design flows across multiple TSMC process technologies, including N3, N2, A16, and A14.

Entities

Analog Devices, Inc. · Cadence

Sources

Cadence Tensilica IP Powers Analog Devices’ Next-Generation DSP Architecture - Edge AI and Vision Alliance [www.edge-ai-vision.com]
Cadence collaborates with TSMC [siliconsemiconductor.net]