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[SITUATION] · [QUIET] · [TECHNOLOGY]
2 clusters · 10 sources · 18 days · First seen · Last updated
Cadence semiconductor technology partnerships
Overview
Cadence has expanded its strategic collaborations within the semiconductor industry, specifically focusing on advancements in AI, high-performance computing (HPC), and automotive technologies.
Through an expanded partnership with TSMC, Cadence achieved tool certification for the A14 process technology. This collaboration includes digital full flow, signoff flow, and custom/analog design flows, supporting designers working on N3, N2, A16, and A14 technologies. These advancements aim to support 3D-IC and wafer-scale systems using TSMC 3DFabric. Subsequent developments include the introduction of new silicon-proven IP for N3P and N2P technologies to enable agentic AI chip design.
Additionally, Cadence partnered with Analog Devices, Inc. (ADI) to utilize its Tensilica DSP architecture. This collaboration focuses on developing next-generation SHARC automotive audio processors, intended to provide a fivefold performance increase to support features such as immersive 3D audio rendering and automated driving alerts.
Entities
Cadence Design Systems · Cadence · Ambiq · Analog Devices, Inc. · M31
Timeline
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[TECHNOLOGY] 2 sourcesCadence announces new partnerships with Analog Devices and TSMC
Cadence is expanding its technological footprint through a new DSP architecture partnership with Analog Devices for automotive audio and an enhanced collaboration with TSMC for advanced AI chip design.
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[TECHNOLOGY] 8 sourcesCadence achieves tool certification for TSMC A14 process technology
Cadence has achieved tool certification for TSMC’s A14 process technology, aiming to accelerate AI and high-performance computing chip designs and reduce iterations by up to 2.5X.
Sources
brasilalemanhanews.com.br · diariodelcauca.com.co · eejournal.com · eetimes.jp · embedded-vision.com · europesays.com · evertiq.com · futurumresearch.com · siliconsemiconductor.net · tradingview.com