Glass core substrate market projected to reach $13.8 billion by 2035

The glass core substrate market is projected to grow from $1.2 billion in 2025 to $13.8 billion by 2035, representing a compound annual growth rate (CAGR) of 28.5% between 2026 and 2035. This expansion is driven by the rising demand for advanced semiconductor packaging to support generative AI, high-performance computing (HPC), cloud data centers, and autonomous driving.

Glass core substrates offer superior dimensional stability, lower thermal expansion, and reduced signal loss compared to traditional organic substrates. They are becoming critical for next-generation architectures, including chiplets, 2.5D/3D integration, and high-bandwidth memory (HBM).

In support of this technological shift, WeiHua Technology has introduced the SP7000G TGV micro-crack rapid scanning system. Designed for mass production, the system can complete a full scan of a 510 mm x 515 mm glass substrate within 20 minutes. This tool aims to improve yield and quality control by detecting internal micro-cracks after metallization and layer addition. Industry experts from Corning and Dai Nippon Printing (DNP) have also highlighted the importance of non-destructive testing and reliability as the industry moves toward mass production of glass core technologies.