Semiconductor glass substrate technology development

The semiconductor industry is transitioning toward glass core substrate technology to meet the high-performance demands of AI chip packaging, high-performance computing, and autonomous driving. Glass substrates are preferred over traditional organic substrates due to their superior rigidity, thermal stability, and reduced signal loss.

Initial developments focused on technical solutions to manufacturing challenges, such as Shinko Electric Industries addressing internal cracking and delamination through resin-reinforced edges. Regional efforts include DNP launching a through-glass via (TGV) pilot line in Japan, Samsung Electro-Mechanics pursuing a joint venture in South Korea, and industry projections suggesting a 510x515mm dimension will become the mass production standard.

As the technology moves toward mass production, the market is projected to grow from $1.2 billion in 2025 to $13.8 billion by 2035. To support this scale, new quality control tools like WeiHua Technology’s SP7000G rapid scanning system have been introduced to detect micro-cracks in large-format substrates, aiming to improve yield and reliability.