Honor Magic 9 series to feature dual 3D biometric security

Honor has announced technical specifications for its upcoming flagship Magic 9 series, highlighting industry-first dual 3D biometric security features. The series will integrate both 3D ultrasonic fingerprint sensing and 3D facial recognition using Time-of-Flight (ToF) sensors. The ultrasonic fingerprint technology is designed to map finger contours and pores, allowing for reliable authentication even with wet or dirty hands, while the ToF facial recognition uses infrared light to create a detailed depth map to prevent spoofing.

In addition to security, the Magic 9 series will feature Honor’s third-generation self-developed C3 RF enhancement chip. This chip utilizes a seven-core RF AI scheduling architecture capable of intelligent switching across 356 frequency band combinations to optimize connectivity across various scenarios.

Leaked specifications for the lineup suggest high-end hardware, including Snapdragon 8 Elite processors, large battery capacities ranging from 8000mAh to 11000mAh, and advanced camera systems featuring up to 200MP sensors. The series is expected to include multiple models, such as the Magic 9 and a Pro Max variant, with varying screen sizes and charging capabilities.