India Boosts Semiconductor Drive with Odisha‑Intel MoU and 2035 Self‑Sufficiency Plan

India’s government has laid out an ambitious semiconductor roadmap calling for 15‑25 % domestic chip self‑sufficiency by 2030 and a $120‑150 billion value chain by 2035, backed by $135‑180 billion of total investment, of which $45‑60 billion is expected from the state. The plan stresses mature‑node logic fabs, advanced packaging and compound semiconductors as the focus areas.

In parallel, the Odisha state government signed a memorandum of understanding with Intel and U.S.‑based 3D Glass Solutions to build an advanced‑packaging glass‑core substrate facility in the Bhubaneswar‑Khurda region. The project, valued at about $3.3 billion, will be phased over five to six years, create more than 1,800 direct high‑skilled jobs and support the broader semiconductor ecosystem.

The design‑linked incentive scheme has already yielded a milestone: Thiruvananthapuram start‑up Netrasemi’s AI System‑on‑Chip NETRA A2000, fabricated on TSMC’s 12 nm process, is entering commercial production. NITI Aayog Vice‑Chairman Ashok Kumar Lahiri noted that India’s semiconductor progress is faster than expected and aims for a top‑six global position by 2032 and top‑three by 2047.