Intel 14A process shows fastest defect improvement since 2012

Intel Chief Financial Officer David Zinsner announced that the development of the 14A fabrication process is showing the fastest defect density improvement since the 22nm node in 2012. The current defect density for 14A is reportedly performing better than the company's target curve.

This technical progress is a key component of Intel's strategy to revitalize its foundry business and compete with TSMC. The 14A process is expected to utilize second-generation RibbonFET gate-all-around transistors, new PowerDirect backside power delivery, and High-NA EUV lithography.

Intel has already begun designing products for the 14A node. Customer engagement is reportedly increasing, with discussions shifting from technical data reviews to inquiries regarding capacity and supply arrangements. The 14A process is scheduled for risk production in the second half of 2027, with high-volume manufacturing expected to begin in 2028.