Packaging companies announce participation in PACK EXPO Chicago 2026

Several packaging and processing technology companies have announced their participation in PACK EXPO International 2026, scheduled for October 18–21 in Chicago, Illinois.

EDL will exhibit at the Massman Companies booth (#S-1730) in the South Hall. The showcase will include EDL machinery, such as the Double Tight Wrapper, which uses two perpendicular bands of LDPE film for secure packaging. Other equipment featured includes the NEM Compact Unscrambler and the NEM Rotary Chuck Capper, alongside various filling and capping systems.

ALTECH will present its latest labeling solutions at the Package Printing Pavilion (Stand W-36052) in the West Hall. Celebrating 35 years of operation, the Italian company will highlight technologies designed for the beverage sector, including the ALline C wraparound labeling system for cylindrical containers and the ALritma automatic label applicator.