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3 clusters · 7 sources · 17 days · First seen · Last updated

Packaging technology participation in PACK EXPO 2026

Overview

Various packaging and processing technology companies have announced their participation in the PACK EXPO International 2026 event in Chicago.

Initial announcements highlighted automation and sustainability, with PAC Machinery planning to demonstrate automatic bagging, vacuum sealing, and shrink wrapping technologies using recyclable materials. SOMIC Packaging intended to debut new machinery and digital troubleshooting tools, such as SOMIC Eagle and SOMIC Connect. Subsequent updates confirmed the participation of additional firms, including EDL, which will showcase wrapping, unscrambling, and capping systems at the Massman Companies booth, and the Italian company ALTECH, which will present beverage-sector labeling solutions like the ALline C wraparound system.

Recent additions to the exhibitor list include RND Automation and Heat and Control. RND Automation intends to feature live pouching demonstrations using its KANGA Poucher, alongside solutions for bagging, tray packaging, and the SureVac leak-testing system. The company also plans to showcase a High-Risk Test Bench for research and development. Heat and Control will focus on potato processing, seasoning, and thermal processing. Their presentation includes the Cascade Water Recirculation system to reduce freshwater consumption, Symphony Seasoning systems to minimize dust exposure, and Tek-Dry thermal processing solutions for high-throughput drying and roasting applications.

Entities

PACK EXPO International · Heat and Control · RND Automation · Ishida · Amcor

Timeline

  1. 2 days ago

    [BUSINESS] 2 sources
    Automation and food processing firms to exhibit at PACK EXPO International 2026

    RND Automation and Heat and Control will showcase various packaging, food processing, and thermal technologies at PACK EXPO International 2026.

  2. 6 days ago

    [BUSINESS] 2 sources
    Packaging companies announce participation in PACK EXPO Chicago 2026

    Packaging companies EDL and ALTECH have announced their participation in PACK EXPO International 2026 in Chicago, showcasing advanced labeling, filling, and wrapping machinery.

  3. 18 days ago

    [BUSINESS] 3 sources
    Packaging companies to showcase automation at PACK EXPO 2026

    PAC Machinery and SOMIC Packaging will showcase new automation, sustainable materials, and digital troubleshooting tools at PACK EXPO International 2026 in Chicago.

Sources

edlpackaging.com · frozenfoodeurope.com · potatopro.com · processingmagazine.com · propakchina.com · prunderground.com · tecnalimentaria.it

This summary has been updated 1 time: see revision history