Quectel launches new AI-powered smart modules and PCBA

Quectel Wireless Solutions has announced two new hardware products designed to enhance AI and vision capabilities in IoT and industrial applications: the QSM603FCP Smart PCBA and the SE200ZC-AP Smart Module.

The QSM603FCP is a Smart PCBA supporting Android and Linux systems. It integrates the MediaTek MT8371 high-performance AIoT chip, featuring an octa-core processor and a neural processing unit (NPU) providing up to 10.3 TOPS. The device supports connectivity options such as 5G RedCap, Wi-Fi 6/6E, and Bluetooth 5.4. It is intended for use in industrial panel devices, edge computing, smart retail, and robotics.

The SE200ZC-AP is a compact smart module built on the Rockchip RV1126B/RV1126BJ platform. It features a quad-core ARM Cortex-A53 CPU, a 12-megapixel HDR image signal processor, and a 3 TOPS NPU. Designed to simplify the development of AI-enabled cameras and industrial vision systems, the module supports 4K video and various interfaces including Gigabit Ethernet and USB 3.0. It is available in both commercial and industrial grades, with the latter rated for temperatures between -35°C and 80°C.