Quectel hardware product launches

Quectel Wireless Solutions has expanded its hardware offerings with new integrated platforms for IoT, industrial, and AI applications.

The company introduced the QLM290P, a smart antenna device that consolidates high-precision GNSS/RTK positioning, LoRa, and global LTE connectivity onto a single PCBA. This platform is designed to assist developers in robotics, autonomous driving, and precision agriculture by reducing the technical risks of component validation.

Following this, Quectel announced two additional products focused on AI and vision capabilities: the QSM603FCP Smart PCBA and the SE200ZC-AP Smart Module. The QSM603FCP utilizes a MediaTek chip with a neural processing unit (NPU) to support edge computing and industrial panel devices. The SE200ZC-AP module, built on a Rockchip platform, features a 12-megapixel image signal processor and a 3 TOPS NPU to facilitate the development of AI-enabled cameras and industrial vision systems.

Expanding its AI capabilities, Quectel has launched a new lineup of three smart modules—the SH503FM, SH603FC, and SH803FD—developed using MediaTek’s Genio platform. These modules feature octa-core Arm Cortex-A78 and Cortex-A55 processors and support Android 15 and Yocto Linux. Designed for on-device AI and edge computing, the lineup provides high-performance computing across entry, mid, and high-performance tiers without requiring integrated cellular connectivity. Technical specifications include LPDDR5X memory support up to 16 GB and dual independent display output. Certain models, such as the QSM603FCP, function as smart PCBAs capable of providing up to 10.3 TOPS of NPU computing power for applications including smart POS systems, industrial tablets, edge AI gateways, and robotics.