Renesas launches Gen 3 DDR5 MRDIMM chipset with 25% higher bandwidth

Renesas Electronics Corporation announced its third‑generation DDR5 Multiplexed Rank Dual In‑Line Memory Module (MRDIMM) chipset, delivering up to 16,000 MT/s and about 25 % more memory bandwidth than the previous generation while using the same DDR5 infrastructure. The solution targets AI‑driven data‑center, cloud and high‑performance‑compute workloads and includes new Multiplexed Registering Clock Driver (MRCD, RRG5013) and Multiplexed Data Buffer (MDB, RRG5103) devices, along with power‑management and system‑visibility features such as Device Equalisation Self‑Train Mode (DESTM).

Renesas will showcase the Gen 3 MRDIMM components at the Future of Memory and Storage Conference in Santa Clara, California, Aug 4‑6 2026. AMD’s corporate vice‑president Amit Goel highlighted the importance of open, standards‑based memory technologies for AI and HPC, while Renesas Memory Interface Division vice‑president Sameer Kuppahalli said the new chipset helps meet the growing appetite for memory capacity and throughput in modern workloads.