Renesas launches Gen 3 DDR5 MRDIMM chipsets with 16 000 MT/s speed

Renesas Electronics Corporation announced its third‑generation (Gen 3) DDR5 MRDIMM chipset solutions, capable of reaching data‑transfer rates of up to 16 000 MT/s. The new modules deliver about 25 % higher memory bandwidth than the previous generation while remaining compatible with existing DDR5 server infrastructure.

The products target the growing bandwidth demands of artificial‑intelligence, cloud‑infrastructure and high‑performance‑computing workloads. They include third‑generation multiplexed register clock drivers (MRCD, RRG5013x) and multiplexed data buffers (MDB, RRG5103x), along with power‑management ICs, SPD hubs and temperature sensors, enabling customers to scale performance without major architectural changes. Renesas will showcase the technology at the Future of Memory and Storage Conference (FMS 2026) in Santa Clara, California, from 4‑6 August 2026 (Booth #807).

AMD’s corporate vice‑president Amit Goel praised the collaboration, noting that “open, standards‑based technologies such as MRDIMM and Renesas’ chipset innovations help data‑center AI and HPC workloads evolve.”