Samsung and Qualcomm expand semiconductor cooperation

Samsung and Qualcomm are deepening their cooperation in the semiconductor sector through two primary initiatives. First, the companies are in advanced discussions regarding Samsung’s 2nm foundry node. Samsung aims to regain market share for Qualcomm’s flagship Snapdragon processors, which have largely been manufactured by TSMC. While pricing and yield optimization are still being negotiated, the potential agreement could provide a critical second source for high-end chip production.

Additionally, Samsung Electro-Mechanics and Qualcomm are collaborating on a new chip packaging technology called ‘Organic Bridge’. Designed for AI chips and high-performance processors, this technology uses organic materials to connect multiple chips within a single package, facilitating rapid data exchange. This approach serves as a potential alternative to Intel’s silicon-based EMIB technology, offering a way to simplify manufacturing processes and potentially reduce production costs for AI, GPU, and HBM memory applications.