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[SITUATION] · [QUIET] · [TECHNOLOGY]

7 clusters · 40 sources · 58 days · First seen · Last updated

Samsung 2nm and advanced semiconductor development

Overview

Samsung has introduced its SF2P 2nm Gate-All-Around (GAA) process, a third-generation platform utilizing a “hypercell” structure to improve performance-to-power ratios. Technical data indicates SF2P offers a performance-to-power ratio up to 2.6 times better than the 4nm (SF4) process. While mass production for SF2P is expected within the year, development for the 1.4nm node has been delayed until 2029. Commercial negotiations between Samsung and Qualcomm regarding 2nm processor manufacturing have experienced volatility. While the companies are in advanced discussions to provide Qualcomm with a critical alternative to TSMC, negotiations recently stalled due to pricing disputes. Qualcomm is seeking lower costs, while Samsung has maintained a firm stance, citing concerns that low production volumes may not offset lower margins. Despite these hurdles, the firms continue to collaborate on a 2.5D chip packaging system using organic bridges to connect multiple chips for AI and data center applications. Samsung is also transitioning its next-generation M2800 series 5G modems to a 2nm process, with development expected to conclude by 2027. This shift is intended to free up 4nm capacity for High Bandwidth Memory (HBM) base dies. Additionally, Samsung is expanding its mature process segment with the 8LPU+ platform, which utilizes Deep Ultraviolet (DUV) production to target edge AI, robotics, and automotive markets with improved efficiency over previous 8nm generations. Samsung Foundry is also reportedly nearing a manufacturing agreement with Anthropic to produce custom AI accelerators using the 2nm SF2 process, managed by Broadcom. In response to surging AI-driven data center demand, Samsung is upgrading its manufacturing facilities in China. The company is reportedly working to convert its Xi’an facility to produce 286-layer NAND memory, with plans to scale production from 5,000 wafers per month by the end of 2026 to 40,000 wafers per month by late 2027.

Entities

TSMC · Qualcomm · Samsung Electronics · Samsung Electro-Mechanics · Samsung

Timeline

  1. [TECHNOLOGY] 18 sources
    Samsung and SK Hynix upgrade China chip plants amid AI demand

    Samsung and SK Hynix are upgrading their Chinese factories to produce advanced NAND flash memory, aiming to meet AI demand and compete with rising Chinese manufacturers like YMTC.

  2. [TECHNOLOGY] 2 sources
    Samsung Foundry may produce custom AI chips for Anthropic

    Samsung Foundry may produce custom AI accelerators for Anthropic using its 2nm SF2 process, aiming to compete with TSMC through high-performance chip manufacturing and advanced packaging.

  3. [TECHNOLOGY] 4 sources
    Samsung and Qualcomm partner on organic chip packaging and 2nm evaluation

    Samsung and Qualcomm are developing cost-effective organic bridge chip packaging for AI and evaluating Samsung’s 2nm process for future semiconductor production.

  4. [TECHNOLOGY] 8 sources
    Samsung Electronics eyes 4nm and 2nm expansion for HBM and AI chips

    Samsung Electronics is planning to expand 4nm and 2nm production to meet rising demand for HBM4/HBM5 base dies, Exynos processors, and Tesla automotive chips amid an AI-driven semiconductor upgrade.

  5. [TECHNOLOGY] 4 sources
    Samsung and Qualcomm expand semiconductor cooperation

    Samsung and Qualcomm are expanding their partnership through 2nm foundry negotiations and the development of ‘Organic Bridge’, a new organic chip packaging technology for AI processors.

  6. [TECHNOLOGY] 3 sources
    Samsung and Qualcomm stall 2nm chip deal over pricing disputes

    Samsung and Qualcomm are in a pricing dispute over 2nm chip manufacturing, potentially delaying production beyond 2026.

  7. [TECHNOLOGY] 2 sources
    Samsung unveils SF2P 2nm GAA process to compete with TSMC

    Samsung is developing its SF2P 2nm GAA process to improve yields and performance, aiming to challenge TSMC's market position with enhanced power efficiency and new cell structures.

Sources

andreagaleazzi.com · android-mt.ouest-france.fr · androidsis.com · ascii.jp · chosunonline.com · cnmo.com · computerbase.de · cryptonomist.ch · cryptopolitan.com · devdiscourse.com · donanimhaber.com · dreamnews.jp · elettronicanews.it · epochtimes.com · evertiq.com · finance.technews.tw · game.techbang.com.tw · geeknetic.es · gizchina.it · go4it.ro · hellot.net · ithome.com · koreaherald.com · news.mynavi.jp · newsbit.nl · sateconomy.co.kr · socialvalue.kr · srnnews.com · tabletzona.es · technologue.id · telegrafi.com · telepolis.pl · the-miyanichi.co.jp · theregister.co.uk · tokenpost.kr · tomshardware.fr · tw.nextapple.com · webtekno.com · weekly.ascii.jp · worldissmall.fr

This summary has been updated 6 times: see revision history