Samsung and Qualcomm partner on organic chip packaging and 2nm evaluation

Samsung and Qualcomm are collaborating on a new 2.5D chip packaging system based on organic bridges. This technological approach aims to optimize communication between various processors within a single package, specifically targeting data centers and artificial intelligence applications. By using organic materials such as polymers and epoxy resins rather than silicon-based bridges like Intel’s EMIB technology, the partnership seeks to create a more cost-effective solution.

The system utilizes an FC-BGA substrate to create a matrix of small holes for the organic bridges. Samsung is currently testing both its own bridges and third-party components to ensure manufacturing efficiency. The design features between 5 and 7 redistribution layers (RDL) with high-precision tracks and separations, aiming for an interconnection density of 500 to 1,000 lines per square millimeter.

Separately, Qualcomm has confirmed it is evaluating Samsung Foundry’s 2nm process for future products. While the upcoming Snapdragon 8 Elite Gen 6 will continue to be manufactured by TSMC, Qualcomm executives described Samsung as a strategic, long-term partner. The company aims to maintain production options by working closely with both Samsung and TSMC for future chip generations.