Samsung Foundry may produce custom AI chips for Anthropic

Samsung Foundry is reportedly nearing a significant manufacturing agreement with AI company Anthropic to produce custom AI accelerators. The project is expected to utilize Samsung’s 2nm SF2 manufacturing process, potentially providing Samsung with a major advantage in its competition against TSMC.

Broadcom is reportedly managing the design and implementation of the accelerator. The initial production phase is planned for approximately 200,000 chips, a figure intended to test the feasibility of the new hardware and infrastructure. The chip is expected to reach a computing power of roughly 4,000 TOPS (INT8) with a thermal design power (TDP) of 1,300W. Memory configurations are expected to include either 192 GB or 288 GB of HBM3E.

To support this hardware, Anthropic may need to develop entirely new infrastructure, including server racks, power distribution, and advanced cooling systems. Samsung may leverage its I-Cube 2.5D packaging technology to integrate the chips with HBM memory. While Samsung’s SF2 process is being developed in South Korea using Low-NA EUV lithography, the company is also expanding capacity at its Taylor facility in Texas, USA.