Siliconware Precision and Intel expand advanced semiconductor packaging

Siliconware Precision Industries has broken ground on a new facility in Douliu, Yunlin, representing an investment of nearly 100 billion TWD. The plant is designed to integrate CoWoS advanced packaging technology to meet the surging demand for AI and high-performance computing. Expected to be operational by 2028, the facility is projected to create over 2,200 jobs, with 1,300 positions expected during its first phase.

In the United States, Intel is advancing its advanced packaging capabilities at its Fab 9 facility in Rio Rancho, New Mexico. The company is focusing on Foveros 3D stacking and EMIB (Embedded Multi-die Interconnect Bridge) technologies to overcome physical limits in chip design. Intel also announced the development of EMIB-T technology, slated for 2026, which aims to improve power efficiency by delivering electricity directly to the chip interior, supporting next-generation AI engines and data centers.