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[SITUATION] · [ACTIVE] · [TECHNOLOGY]

3 clusters · 9 sources · 8 days · First seen · Last updated

Semiconductor advanced packaging and AI technology expansion

Overview

The semiconductor industry is expanding advanced technologies and manufacturing capacity to support AI and high-performance computing demands.

In Taiwan, TSMC is preparing its COUPE co-packaged optics (CPO) platform for mass production by 2026 to improve AI data center interconnects. However, the industry faces testing bottlenecks due to a lack of unified standards and slow manual optical probe alignment. Siliconware Precision Industries has broken ground on a new facility in Douliu, Yunlin, investing nearly 100 billion TWD to integrate CoWoS advanced packaging technology. Expected to be operational by 2028, the plant is projected to create over 2,200 jobs.

Optical component demand is also surging. Lumentum reported record revenue of $1.006 billion for its fourth fiscal quarter of 2026, a 109.3% year-on-year increase, driven by high-speed optical module components like EML laser chips. The company noted that demand for ultra-high-power lasers is accelerating, causing supply shortages, and confirmed its first order for External Laser Source (ELS) modules for delivery in late 2027. Meanwhile, Largan Precision is pivoting toward CPO by investing in automation, aiming to complete its first automated pilot line for Fiber Array Units (FAU) by September.

In the United States, Intel is enhancing its packaging capabilities at its Rio Rancho, New Mexico, facility. The company is utilizing Foveros 3D stacking and EMIB technologies, while developing EMIB-T technology for 2026 to improve power efficiency for next-generation AI engines.

Entities

Yunlin County · COUPE platform · Michael Hurlston · Veeco Instruments Inc. · New Mexico

Timeline

  1. 5 days ago

    [TECHNOLOGY] 2 sources
    Lumentum and Largan Precision expand AI optical component footprints

    Lumentum reports record $1 billion quarterly revenue driven by AI optical chip demand, while Taiwan's Largan Precision pivots toward Co-Packaged Optics (CPO) to capture semiconductor growth.

  2. 7 days ago

    [TECHNOLOGY] 4 sources
    Siliconware Precision and Intel expand advanced semiconductor packaging

    Siliconware Precision Industries is investing 100 billion TWD in a new CoWoS-capable plant in Taiwan, while Intel advances its Foveros 3D and EMIB packaging technologies in the US to meet AI demand.

  3. 12 days ago

    [TECHNOLOGY] 4 sources
    TSMC's COUPE Platform and Veeco's LUMINA+ System Accelerate AI Data Center Optical Interconnects

    TSMC's COUPE CPO platform targets 2026 mass production but faces testing bottlenecks, while Veeco's LUMINA+ MOCVD system secures an order to boost InP laser output for AI data‑center transceivers.

Sources

arts-spectacles.com · finance.technews.tw · mommygearest.com · newswire.telecomramblings.com · nextapple.com.sg · pulse2.com · stocknews.com · tamers2021.hateblo.jp · techritual.com

This summary has been updated 1 time: see revision history