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Packaging technology participation in PACK EXPO 2026

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2026-09-22 08:27 UTC → 2026-09-26 22:36 UTC · added ~~removed~~

Various packaging and processing technology companies have announced their participation in the PACK EXPO International 2026 event in Chicago. Initial announcements highlighted automation and sustainability, with PAC Machinery planning to demonstrate automatic bagging, vacuum sealing, and shrink wrapping technologies using recyclable materials. SOMIC Packaging intended to debut new machinery and digital troubleshooting tools, such as SOMIC Eagle and SOMIC Connect. Subsequent updates confirmed the participation of additional firms, including EDL, which will showcase wrapping, unscrambling, and capping systems at the Massman Companies ~~booth. Additionally,~~ booth, and the Italian company ~~ALTECH announced it~~ ALTECH, which will present beverage-sector labeling solutions ~~specifically designed for the beverage sector, such as~~ like the ALline C wraparound ~~labeling~~ system. Recent additions to the exhibitor list include RND Automation and Heat and Control. RND Automation intends to feature live pouching demonstrations using its KANGA Poucher, alongside solutions for bagging, tray packaging, and the SureVac leak-testing system. The company also plans to showcase a High-Risk Test Bench for research and development. Heat and Control will focus on potato processing, seasoning, and thermal processing. Their presentation includes the Cascade Water Recirculation system to reduce freshwater consumption, Symphony Seasoning systems to minimize dust exposure, and Tek-Dry thermal processing solutions for high-throughput drying and roasting applications.

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